Chinese tech company you never heard of may have forced Samsung’s hands to sign patent deal for next generation flash

News Snapshot:

Samsung has signed an agreement with China’s YMTC to use its hybrid bonding tech The move will prevent infringement claims in production of 400-layer NAND US-China trade tensions may also have influenced the agreement Samsung Electronics has signed a contract with Yangtze Memory Technologies Co. (YMTC) which will allow it to use the Chinese semiconductor company’s bonding technology in the production of its 400-layer NAND flash memory. Founded in 2016 and headquartered in Wuhan, China, YMTC is a subsidiary of Tsinghua Unigroup, which is backed by the Chinese government. It focuses on 3D NAND flash memory, a critical component in...